The two standards come under the COM-HPC banner, and each is intended for different purposes: one is for server type applications intended for high-performance computing and data transmission, and the other one is for embedded computing with graphics requirements.
The COM-HPC standards offer unique form factors and optimised pin definition to support powerful CPU, memory capacity up to 1TB, and next-generation super-speed interfaces such as PCIe Gen4/5 (16Gbps/32Gbps), USB4.0 (20Gbps), and 10G ports.
COM-HPC specifications are currently under definition, with companies such as Advantech playing a key role in the process alongside other leading manufacturers and the PICMG organisation to discuss the COM-HPC concept at the earliest stages.
Rex Lee, Director of Advantech Embedded IoT Group said “Advantech sees opportunity in the market for cost-performance balanced architectures from cloud computing to edge computing. At COM-HPC, our computer-on-modules will migrate server-grade performance to the edge. We are working together with PICMG and leading embedded companies to meet these market requirements.”