Additions to the zSFP+ Interconnect System support 56 Gbps PAM-4 channels in a stacked 2xN port configuration, giving next-generation Ethernet and Fibre Channel applications optimised signal integrity. The product is, Molex claims, the first of its kind. OEMs requiring high-density interconnect applications now have the ability to utilise channels with individual lane data rates up to 56 Gbps PAM-4 in a stacked 2xN configuration. While providing those high speeds, the updated product still maintains a low insertion loss, crosstalk, thermal and electromagnetic interference (EMI) containment from the previous zSFP+ Interconnect System.
“...being able to stay ahead of the curve on the backend becomes more challenging for data centres, networking OEMs and telecoms.” said Chris Hagerman, global product manager, Molex. “Molex provides a passively cooled solution by using an enhanced airflow cage design to maximise airflow through the cage and connector effectively lowering the temperatures by about 17C. This yields optimal thermal management for next-gen systems while eliminating the need for costly heat sinks or cooling modules.”
The updated system has multiple features that allow for greater flexibility and lowered costs for users. The 56 Gbps PAM-4 channel products include EMI ganged cages—which are available in multiple port sizes from 2x1 through 2x12—allows for flexibility of PCB signal routing of LEDs.
Molex has also created a next-generation terminal and wafer on the stacked integrated connectors within the zSFP+ Interconnect System. The advanced terminal provides superior signal integrity for 56 Gbps PAM-4 applications. The system allows for users to merge standard cables and modules with the increased data-rate accepted.