Highest-capacity monolithic memory

August 16, 2019 //By Ally Winning
Micron’s 16Gb LPDDR4X offers improvements in power consumption, speed and what the company claims is the industry’s highest-capacity monolithic die.
Micron’s 16Gb LPDDR4X offers improvements in power consumption, speed and is packaged in what the company claims is the industry’s highest-capacity monolithic die.

The device delivers up to 16GB of low-power DRAM (LPDRAM). It is also available in a UFS-based multichip package (uMCP4) for designers looking for low power devices combined with smaller dimensions. The volume shipments of these LPDDR4X and uMCP4 is leading the industry transition to 1z nanometer node.

Micron’s 1z nm LPDDR4X products offer low power consumption while maintaining fast LPDDR4 clock speeds of up to 4,266 Mbps. They consume up to 10% less power than previous-generation solutions in memory-intensive applications. LPDDR4X doubles the memory capacity without increasing the package footprint used for prior generations of LPDDR4.

Micron LPDDR4X memory solutions are available today in eight different configurations of UFS-based multichip packages (uMCP4), ranging from 64GB+3GB to 256GB+8GB.

More information

https://www.micron.com

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