Analysts’ teardown estimates iPhone X bill-of-materials at $370

November 22, 2017 //By Graham Prophet
Analysts’ teardown estimates iPhone X bill-of-materials at $370
Teardown engineers at analysts IHS Markit have completed a preliminary physical dissection of the Apple iPhone X and found that the model A1865 version of the smartphone with 64 gigabytes (GB) of NAND memory carries a bill of materials (BOM) of $370.25.

The information published by the analyst includes a sourcing list of all the semiconductor content of the smartphone; one conclusion of the teardown is that, “[the] AMOLED screen and TrueDepth sensing are key hardware differentiators in [the] most expensive smartphone to date.”

 

The overview of the teardown comments that, “The assembly and testing of the TrueDepth system and its individual components is challenging and likely a factor in the production delays,” adding, “For instance, the assemblage and test of the Texas Instruments and ST Microelectronics subsystem for the flood illuminator is far from trivial and requires a high number of test equipment pieces.”

 

Far-from-trivial could equally be applied to many other aspects of the construction; for example, the main PCB and RF/interface PCBs are interconnected into a single assembly by an interposer/soldered via peripheral ring ( see images reproduced below, source IHS Markit ). The design also fits maximum battery capacity around the disparate sub-systems in the design by employing two separate cell assemblies.

 

IHS Markit; report here

 

 


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