Thermal management material for thin spaces

December 21, 2016 // By Graham Prophet
This heat transfer sheet in 200 µm (0.2 mm) thickness guarantees thermal stability up to 400°C with thermal conductivity up to 400 W/mK.

From Panasonic Automotive & Industrial Systems, this highly-compressible thermal interface material (TIM) reduces contact thermal resistance between rough surfaces in extremely thin spaces. Soft-PGS enhances the thermal coupling between heat producing devices (heat sources) and heat dissipation devices (heat sinks). It is a 200 µm thick graphite-based sheet designed for use as a thermal interface material for IGBT modules. Soft-PGS can be compressed by 40%, is easy to install, and has lower labour and installation costs than thermal grease or phase change material. Soft-PGS guarantees thermal stability of up to 400°C and high reliability against intense heat cycles (-55°C to +150°C). Its thermal conductivity is guaranteed at 400 W/mK for the X-Y direction and at 30 W/mK in Z direction. Panasonic offers a wide range of standard sheets for different IGBT modules from various suppliers.

 

Panasonic further comments; “A paste-like TIM-layer below a module is never of homogenous thickness and additionally, most paste-like thermal solutions also degrade and age over time. Compared to thermal grease and PCM, Soft-PGS fits uneven surfaces far better as well as offering superior workability, reliability and thermo stability.”

 

Panasonic (Panasonic Automotive & Industrial Systems Europe (PAISEU)); Product data